北京大学学报(医学版) ›› 2022, Vol. 54 ›› Issue (1): 140-145. doi: 10.19723/j.issn.1671-167X.2022.01.022
李怡1,王丽瑜2,刘晓强1,△(),周倜3,吕季喆1,谭建国1
LI Yi1,WONG Lai U2,LIU Xiao-qiang1,△(),ZHOU Ti3,LYU Ji-zhe1,TAN Jian-guo1
摘要:
目的: 评价不同材料及厚度椅旁计算机辅助设计和计算机辅助制作(computer-aided design and computer-aided manufacturing,CAD/CAM)瓷贴面的边缘粗糙度和边缘密合度,旨在为瓷贴面的临床应用提供参考。方法: 在树脂人工牙上进行对接型瓷贴面牙体预备,利用扫描仪扫描预备体,利用椅旁切削设备CAD/CAM瓷贴面。根据陶瓷材料类型(玻璃基陶瓷和树脂基陶瓷)及贴面厚度(0.3 mm和0.5 mm)将贴面分为4组(n=9),共36个。利用体式显微镜拍摄瓷贴面边缘形貌的数码照片,在软件内测量边缘粗糙度;利用间隙检查剂和数字化扫描与测量方法评价瓷贴面的边缘密合度;同时利用万能力学试验机测试玻璃基陶瓷和树脂基陶瓷条形试件(n=20)的力学性能。结果: 厚度为0.3 mm和0.5 mm玻璃基陶瓷贴面的边缘粗糙度分别为(24.48±5.55) μm和(19.06±5.75) μm,差异有统计学意义(P<0.001);厚度为0.3 mm和0.5 mm树脂基陶瓷贴面的边缘粗糙度分别为(6.13±1.27) μm和(6.84±2.19) μm,差异无统计学意义(P>0.05);玻璃基陶瓷贴面的边缘粗糙度大于树脂基陶瓷,差异有统计学意义(P<0.001)。厚度为0.3 mm和0.5 mm玻璃基陶瓷贴面的边缘密合度分别为(66.30±26.71) μm和(85.48±30.44) μm,厚度为0.3 mm和0.5 mm树脂基陶瓷贴面的边缘密合度分别为(56.42±19.27) μm和(58.36±8.33) μm,4组间差异均无统计学意义(P>0.05)。玻璃基陶瓷的弯曲强度为(327.40±54.25) MPa,弯曲模量为(44.40±4.39) GPa,回弹模量为(1.24±0.37) MPa;树脂基陶瓷的弯曲强度为(173.71±16.61) MPa,弯曲模量为(11.88±0.51) GPa,回弹模量为(1.29±0.27) MPa;玻璃基陶瓷的弯曲强度和弯曲模量大于树脂基陶瓷,差异有统计学意义(P<0.001),但两种材料的回弹模量差异无统计学意义(P>0.05)。结论: 椅旁CAD/CAM玻璃基陶瓷贴面的边缘粗糙度大于树脂基陶瓷贴面,但二者的边缘密合度无显著差异。增加贴面厚度可降低玻璃基陶瓷贴面的边缘粗糙度,但对树脂基陶瓷贴面的边缘粗糙度无影响。
中图分类号:
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